Design Simulation And Processing Of Cantilever Sensor Based On Electro Thermal Driving Piezoresistive Detection

With the development of MEMS,NEMS and nano-fabrication technology,the miniaturization and integration of devices has become a routine requirement.The development of scanning probe sensors is a big step forward for nanoscale detection,scanning,information storage,lithography and direct writing.Self-driven self-detecting microcantilever sensors have the advantages of high integration,small size and simple fabrication in the field of morphology detection and direct writing without mask lithography.Among them,the electro-thermal driven cantilever sensor has the advantages of high driving efficiency,stable amplitude,strong controllable driving force and simple preparation process.To date,there have been no studies in the field of scanning probe lithography(SPL),especially thermally driven probe for lithography function in China.The thermal driven probe microsensors are completely dependent on foreign imports.For the micro cantilever sensor can achieve multi-functional integration,real-time detection and portable applications,to make up for the gap in this field in China,we use theoretical calculation combined with finite element analysis method,with the help of COMSOL Multiphysics simulation platform,to design the electric thermal driven cantilever sensor.According to the experiments in literatures,the piezoresistive resonant feedback circuit was designed.The main results obtained in this thesis are in the following:1.Through the design and simulation of the structure and material,we propose a resistance hollow-out electrothermal drive for piezoresistive detection of cantilever beam.Compared with the existing SPL cantilever sensor from Nano Analytik Company in Germany,the temperature drive efficiency is improved by 49.6% under the same size;The power drive efficiency is increased by 68.8%;The piezoresistive sensitivity of the sensor is 3.77 m V/100 ?N,and the nonlinear degree is 0.04%.The thickness ratio between the middle insulation layer and the top layer is optimized,and the shape variable is increased by 23.8%.2.Based on the existing micro-nano machining technology,the processing flow of resistance hollowing type was designed,including 8 steps of needle preparation,piezoresistive doping,low pressure vapor deposition,ion implantation,magnetron sputtering,lithography and wet etching,and 7 masks were designed.It is planned to complete the device fabrication and performance test in the micro/nano machining process line of the Institute of Microelectronics,and dedicated to the realization of a multi-layer composite microcantilever sensor with self-driven and self-detection functions.