Research On Flip-chip Soft-landing Interconnection Based On Feed-force-sensing Fusion

With high-density,miniaturization,lightness,and high integration has become the development trend and upsurge of a new generation of chips,flip-chip technology is used as a representative of advanced packaging technology,which has the advantages of low interconnection length,ultra-small size,high yield,low cost and so on,has aroused great interest of people.However,the characteristics of micro-array(<5?m),high-density(< 10E4/mm2)and fine-spacing(<10?m)are becoming popular.In the process of flip-chip interconnection,the flip-chip bonding execution system is in high dynamic conditions,coupled with the small size of the chip and frequent large-stroke high-speed movement,which can easily cause various nonlinear effects and too much or too little bonding pressure will cause interference in the process of chip electrical interconnection.Therefore,in order to realize the high quality,high flexibility and high reliability of soft-landing interconnection between the chip and the package substrate,this paper has carried out research on this.A new chip of soft-landing interconnection strategy is proposed.A new type of chip flip-chip soft landing interconnection system(hardware and software)has been developed,which can realize the functions of chip position feed motion and force perception control,and can provide reference for practical application.The specific research content of the thesis is as follows:1.The current mainstream flip-chip packaging technology are introduced,explain the significance of active soft-landing to flip-chip interconnection,and clearly point out that the flip-chip interconnection cannot be completed only by position and the defect of the flip-chip device's force perception control.It is necessary to consider how to achieve hybrid control of position/force to complete flip-chip interconnection in one step,and achieve compliant and consistent interconnection during flip-chip soft landing.In-depth research on the development trend and research status of domestic and foreign flip-chip packaging equipment,precision mechanism and hybrid control of position/force has determined the research goals of this article and technical solution.2.By analyzed the chip flip-chip interconnection process and flow,we compare different processes and determine the interconnection means.In order to achieve one-step precise interconnection,the accuracy of position feed and force perception control is required,and a chip flip-chip soft landing interconnection system is designed.It is determined that the system uses the type of linear motor to complete the position feed movement,and solves the problems caused by the vertical installation of the motor;designed a flexible flip-chip bonding mechanism integrated with strain gauges and piezoelectric drives as a force sensing and control module,and temperature heating control system: In order to realize the observation of the flip-chip interconnection process,a vision module is built;finally,the control card is selected,and the motion control system structure diagram of the chip flip-chip soft-landing interconnection system is given.3.Through the analysis of the drive control principle of the entire linear motor,it is pointed out that the force of the linear motor is indirectly controlled by analog control,and it is an open-loop structure,which is very unfavorable to position control.In the positioning control,suitable control signals are used,and the driver position control algorithm is tested and debugged,which improves the accuracy of the position feed.In order to realize the force perception and control,the static and dynamic analysis of the flexible flip-chip bonding mechanism at the linear motor terminal is carried out.Solid Works and ANSYS are designed and simulated.The simulation results show that the mechanism has an excellent linear relationship between force and displacement,which is conducive to force perception and control.4.Using the idea of C++ and HIPO modeling method,the upper computer software of the flip-chip soft-landing interconnection system is developed using the Qt framework,and the realization of the pseudo code of the bit force switching is given,and the software is tested through experimental test successfully.Finally,the entire prototype system are built and each of module are tested,which determined the reliability of the chip flip-chip soft landing interconnection system.