Fabrication And Testing Of Platinum Film Temperature Sensor Based On Non-Flat And Buckled Structure

With the diversification of the application environment,in order to track the changes of the in-situ temperature field on the surface of the measured object in real time and accurately,at the same time,it is necessary to adapt to complex structures such as planes and curved surfaces.Therefore,on the basis of the MEMS device manufacturing technology based on silicon wafers and flexible polymers,the process of making SiO₂ thin film insulating layer and platinum thin film patterning directly on the surface of metal probes is studied.This process technology realizes the direct matching of sensitive components with high-curvature objects without subsequent transfer and mounting of the substrate,reducing the heat loss between the surrounding environment and the object,and improving the working stability of the device.As a commonly used precious metal temperature sensitive material,platinum is widely used in temperature field measurement due to its good thermal response,high accuracy,high temperature coefficient of resistance and wide operating temperature range.Platinum is also considered to be biocompatible and therefore suitable for medical applications.Based on this,this article mainly studies the following:1.First,master the basic working principle of the thermal resistance temperature sensor and the calculation method of the square resistance,and design the resistance,shape and size of the thermistor strip,lead and metal electrode;Then,according to the process flow of the silicon-based temperature sensor,L-edit software is used to design the published drawing,and the preparation process of the silicon-based temperature sensor is explained in detail;Finally,the electrical performance of the silicon-based temperature sensor is tested and analyzed.Through observation,it is found that the silicon-based platinum resistance temperature sensor has excellent linearity,the sensitivity of the sensor is 0.20% ?-1 and the hysteresis error is0.39.It proves that the silicon-based platinum film temperature sensor has stable working performance,which lays the foundation for the subsequent preparation of the sensor on a flexible substrate.2.By comparing different polymer substrates,the platinum film temperature sensor was finally prepared on a polyimide substrate,and the electrical and mechanical properties of the flexible platinum film temperature sensor were tested and analyzed.According to the measured data,the resistance temperature curve of the flexible temperature sensor is drawn,and it can be seen that the sensor has good linearity.Through linear fitting,the sensitivity of the sensor is0.6345% ?-1,and after three repeated heating and cooling processes,the sensor still has good repeatability.Through different degrees of bending tests on the polyimide substrate,it is proved that the sensor has excellent mechanical properties and strong anti-interference ability,which improves the accuracy of the sensor and facilitates the temperature monitoring of the sensor on any curved surface.3.In the process of preparing the platinum film temperature sensor based on the metal probe,the ICPECVD deposition system is used to prepare a 2um SiO₂ film to solve the insulation problem of the metal probe,and then the two key processes of glue spraying and proximity exposure are used to achieve The end surface of the probe is patterned,and finally a platinum film with a complete structure and a flat surface is formed through sputtering and stripping processes.By studying and comparing the influence of different annealing temperatures on the electrical performance of the sensor,it is determined that 500?,5min is the most suitable annealing condition.By controlling the environmental factors and annealing treatment conditions,the performance of the platinum film has been significantly improved,The impurities and defects generated in the whole process are eliminated,and the linearity,sensitivity and stability of the sensor are improved.In summary,studying the substrate and annealing temperature is very important for fabricating a metal thin film sensor with high stability and fast response on the surface of a buckled metal structure.