Research On Vapor Chamber Based On Blade Structure

The high integration and miniaturization of electronic components have caused serious heat dissipation problems for electronic equipments.High temperature causes the reliability and working performance of electronic equipment to decrease.As an efficient phase change heat transfer element,the vapor chamber is the first choice to solve the high temperature problem of electronic equipment,and has broad development and application prospects.After years of baptism in nature,plant leaves form a perfect water flow and heat dissipation system.In this paper,based on the mesh vein structure of the leaves,a sintered wick vapor chamber with the characteristics of the leaves structure is designed,and the copper powder particle size is 100 mesh.Drawing the wick structure with mesophyll tissue and leaf vein network with the aid of3 D modeling software.It designs and processes wick sintering mold.The sintered wick structure vapor chamber with the leaf vein width of 0.6mm,0.8mm,and 1mm is prepared through the process routes of filled copper powder particles,diffusion welding,and vacuuming.The porosity of the wick structure of the sintered leaves vapor chamber was measured,and the surface morphology of the sintered wick structure was photographed using a scanning electron microscope to observe the gap between the copper powder particles and the sintering wick molding effect.It Sets up an air-cooled test platform for the leaves structure vapor chamber,and conducts an experimental study on the temperature uniformity,thermal resistance and maximum heat transfer power of the surface of the condensing end of the leaves structure vapor chamber.The vapor chamber of each kind of wick structure is set with 3 different filling rates,and the experimental tests are carried out under the three heat source areas.The experimental results show that for VC2 and VC4 with the same filling rate,VC2 has better temperature uniformity in the heat source area of 20mm×20mm,30mm×30mm,but VC4 has lower thermal resistance under the heat source area of 20mm×20mm,30mm×30mm,and 40mm×40mm.The temperature difference between the condensation surface of VC5 and VC6 is less than 5? under the three heat source areas,while the highest temperature difference of the condensation surface of VC1 is 17.9?.The thermal resistance of the all sample vapor chamber in this experiment showed a trend of first increasing and then decreasing with the increase of heating power,but the maximum thermal resistance of the experimental sample was 0.12(?/W)and the average thermal resistance was 0.053(?/W).The air-cooled heat dissipation way is used to dissipate heat from the vapor chamber.Due to the low heat transfer coefficient of air convection,it is difficult to improve the heat dissipation efficiency of the vapor chamber.The water-cooled heat sink can bring good heat dissipation efficiency to the vapor chamber.The zigzag-serpentine microchannel heat sink has better hydraulic performance and heat transfer performance when the incidence angle ? is 30°,and the hydraulic performance is poor when the incidence angle ? is 90°;The zigzag-serpentine microchannel heat sink has the best temperature uniformity,and the hydraulic performance and heat transfer performance of the water-cooled microchannel heat sink can be improved by reducing the angle of incidence.