Researh On Simulation And Experiment Of Double Target Magnetron Sputtering Process

In vacuum coating,magnetron sputtering with its lower sputtering temperature and higher deposition rate is widely used in new energy batteries,super capacitors,the third generation of semiconductor chips and flexible electronic devices and other new products,new materials in the field of thin film manufacturing and scientific research plays an important role.However,a single film component often cannot meet the complex performance requirements,so how to prepare the important performance parameters of micro/nano composite film is a research focus.In this context,this study through the simulation and experiment method of combining the for C,Al,SiC and Al2O3 in double target magnetron sputtering target material equipment of sputtering process,plasma atmosphere and particle transport process are studied,for high quality of sputtering film technology to explore and magnetron sputtering study provide guidance and related physical process.The main research contents are as follows:（1）Based on the theory of low-temperature plasma,a two-dimensional discharge model of the dual-target sputtering system was established.COMSOL Multiphysics 5.5（COMSOL）software was used to simulate the direct exile electroluminescence process in the sputtering system,and the plasma distribution in the system was analyzed when the steady discharge was achieved.The electron density distribution,metastable ion distribution,argon ion distribution,electron temperature and electric potential distribution were obtained.Compared with plasma characteristics in classical discharge structure,the validity of the model was verified by glow discharge theory.（2）Based on the COMSOL simulation and the influence of structural parameters on plasma distribution in the discharge process,the structure parameters were optimized by taking the electron density and the distance from the target as indicators,and the structure with better electron density distribution was obtained,which improved the sputtering efficiency.The effect of target magnetic field on electron density distribution is studied,and the target magnetic field is optimized by changing the structural parameters of permanent magnet and adding magnetic guide plate.The structure of permanent magnet with optimal magnetic field distribution is obtained,which increases the utilization rate of target material.（3）By coupling plasma module and particle tracking module in COMSOL,the incident argon ion information of C,Al,SiC and Al2O3 targets at different target powers during sputtering is calculated,which is used as the input boundary condition of TRIM software,and the sputtering process of C,Al,SiC and Al2O3 targets is simulated and analyzed.Draw sputtering yield and ratio of emergent particle element parameters changing with the target power,combined with the energy of incident particles loss distribution calculation of target thermal energy input to the target of the heat exchange system,through direct contact with Fluent soft ware cylindrical cooling chamber structure simulation analysis,and according to its structural characteristics and puts forward an improved structure of cooling effect,The overall temperature and temperature difference of the target surface are reduced,and the heat transfer efficiency of the cooling system is improved.（4）to verify the correctness of the dual target magnetron sputtering process simulation and study the influence of the particle transport process for film,using the glow discharge emission spectrometry and mass spectrometry to detect the plasma sputtering process,analyzes the different target power C,Al,SiC and Al2O3 under separate sputtering target material and the plasma characteristics of Al,SiC sputtering,The experimental results were combined with the simulation results to verify the correctness of the simulation results.XPS analysis was carried out on the sedimentary materials,and the relationship was established with the previous detection and simulation results.