Study On Fabrication And Heat Transfer Performance Of Heat Pipe Plate With Copper Foam Wick

Thermal management of highly integrated electronic components with ultra-high heat flux(over 100 MW/m~2)has become the critical bottleneck for the continuous development of next generation information communication technology(ITC).Many conventional cooling methods fail to address the unprecedented thermal challenge due to their complex structure design or limited heat transfer performance.Heat pipe plates,on the other hand,offer a promising solution to the thermal management issue owing to its high effective thermal conductivity,strong compatibility with different packaging environment,and the passive operation feature.It has become a hot issue of research on how to develop new and more efficient heat transfer heat pipes.In this paper,a kind of heat pipe plate using super-hydrophilic oxidized copper foam wick was the research object.Three aspect,designing and manufacturing process of the heat pipe plate,super hydrophilic surface oxidation of the copper foam wick and heat transfer performance of the heat pipe plate,were studied systematically.The copper foam materials with different pore densities(characterized by PPI)were oxidized to obtain super-hydrophilic surface.Subsequently,they were used as the wick structure to manufacture the heat plates in 4 different cavity heights.In order to improve the efficiency and accuracy of the experimental results,the experimental platforms based on two kinds of different testing methods were set up.Infrared visualization and thermocouple measurement methods were studied to research the effects of PPI of the copper foam wick,filling ratio and cavity heights of the heat pipe plates on the heat transfer performance of the heat pipe plates.Meanwhile,an experiment was carried out to study the startup performance of the heat pipe plates.The results showed that the experimental results obtained by Infrared visualization and thermocouple measurement methods were high consistency.Influence of filling ratios,cavity heights and PPI wick structures on the heat transfer performance of the heat pipe plate was explored experimentally.The results showed that the filling ratio has a significant influence on the heat transfer performance of the heat pipe plates.The heat transfer performance of the heat pipe plates first increases and then decreases with the increase of filling ratio.Under certain condition,that is,the height of the inner cavity is not exceed 10 times the height of the wick,the larger the height of the inner cavity,the better the heat transfer performance is obtained.Limited by the processing technology,the maximum pore density of the copper foam wick is 130 PPI.Increasing the PPI value of the copper foam wick is beneficial to improve the heat transfer performance of the heat pipe plate.Through testing the dynamic thermal performance of the heat pipe,it was found that the startup time of the heat pipe plate based on copper foam wick developed in this study is within 10 s and its stabilization time is about 3 minutes,which has greatly improvement on startup and stability speed compared with the mainstream heat pipe products on the market.The results presented that the starting performance of the heat pipe plate developed in the study is excellent.