Research On Simulation And Fabrication Technology Of High Performance Thermoelectric Cooling

Thermoelectric Cooler（TEC）is a solid state device that provides stable cooling or heating for the environment.It has the advantages of no noise,no refrigerant and accurate temperature control.TEC device consists of thermoelectric materials,copper electrode and ceramic substrate.Thermoelectric materials are the main component of TEC to produce cooling or heating.In this paper,the influence of the geometry of thermoelectric materials on the cooling performance of TEC is studied to improve the cooling performance of TEC.Based on the rectangular cylindrical thermoelectric materials on the market,the cooling performance of various geometric thermoelectric materials is analyzed theoretically,calculated by thermoelectric simulation and tested experimentally.The main research contents and results of this paper are as follows:（1）The results of theoretical calculation and simulation analysis show that,in the same input current,the thermoelectric materials with special-shaped structure have higher cooling temperature difference than those with ordinary rectangular columnar structure,and the larger the tangent angle is,the higher the cooling temperature difference will be.If the heat transfer cross-sectional area between the hot and cold ends of the special-shaped thermoelectric materials is the same,that is,the heat transfer volume of the thermoelectric materials is the same,then the cooling performance of the special-shaped thermoelectric materials is nearly the same;（2）In this paper,a method for the preparation of thermoelectric materials with anisotropic structure is designed,and the one-sided trapezoidal thermoelectric materials with accurate angle and smooth surface can be used for experimental production and testing.In the manufacturing process of multistage TEC,an improved DPC ceramic substrate is used for drilling and copper plating.Through this substrate,the electrical interconnection between layers of multistage TEC can be realized without external wiring,which improves the service performance and life of multistage TEC;（3）The simulation analysis and experimental test of the single-stage and multi-stage TEC models show that the multi-stage TEC can achieve higher cooling temperature difference.If the shape of thermoelectric materials is the same,the maximum current I_opt required by the multi-stage TEC to achieve the maximum temperature difference is smaller;（4）In this paper,the undercooling characteristics of TEC are compared with the geometry of thermoelectric materials.The results show that applying a short pulse current to TEC can make the TEC reach a lower cooling temperature,and the smaller the heat transfer volume of the thermoelectric materials,the lower the temperature Tc and min of the cold end of TEC.The temperature difference of TEC can be improved by adjusting the pulse current,pulse width and pulse shape properly.