Design And Implementation Of Chip Type Miniature Fuse

Chip type miniature fuse plays a crucial role in circuit over-current protection.Due to its electrical stability and reliability,it is applicable for the over-current protection of high reliable electronic systems,key function modules as well as components such as in aviation,weapons,electronics,ships and communication etc.As time goes by,the development of electronic industry has been promoted spirally,especially for digital and microelectronic technology,which are sufficiently and are applied in many fields.New topics are being brought to attention for circuit protection,and from the perspective of chip type small fuse,the development process has been deepened continuously.The development of this technology has moved towards lead-free,diversified and miniaturization step by step.According to both domestic and international market situation at the present,combined with the company’s actual demands,this project aims to use simulation technology optimizing the structure design and process parameters of the chip type miniature fuse,and further improve the preparation technology level as well as expand the specification and model to form series products in order to lay the foundation for industrialization.Chip type miniature fuse is a kind of high precision fuse,which has high requirements for production environment.All parameters need to be debugged and verified under the constant temperature and humidity.In actual production,the performance and index of chip type miniature fuse produced by different material selection of the same functional layer can be different.In order to achieve the best effect of each functional layer,the method of analogy by controlling a single variable is adopted to find out the best process parameters suitable for our company’s chip type small fuse production,such as screen printing,firing,sputtering and electroplating,so that the final balancing can be obtained in producing accurate chip miniature fuse sample.During the designing and implementation of chip type miniature fuse,several technical improvements have been aiming at the difficulties of unevenness of screen printing lines,coating and sputtering layer.After completing the preparation of chip type miniature fuse sample,a series of destructive tests are to be carried out to verify various properties,such as resistance to welding heat,voltage drop etc.It is concluded that the change rate of resistance value of small sample products is within 10%.The outer appearance is not damaged and the electrical performance is satisfying with fairly good stability,meeting the goal of the research.A complete production line can be set up to meet the market demand and to fill the market vacancy,where the company can benefit from the profit growth.However,the research is not over.More technical issues in the actual production progress will need to be overcome gradually,so as to improve the product quality as well as the qualification rate of finished products.