Research On Pretreatment Delamination And Experiment Based On Solid Circuit Fused Deposition Molding

Fused deposition modeling is a three dimensional model based post processing technology for extruded wire extruded and laminated by layer by layer.Comparing with other additive manufacturing technologies,it has advantages of high material utilization,low cost and simple post-processing.It is suitable for small batch customized manufacturing.However,the main reasons that restrict the development of FDM are the dimensional accuracy and single function of the parts.Therefore,this paper focuses on the problems of low dimensional accuracy,low molding efficiency,the conductive part and the non-conductive part cannot set the process parameters independently for the pretreatment of layered slicing and so on.It lays a foundation for the basic electronic devices and stereoscopic circuits made of composite conductive wires by melt deposition.The conductive properties of three kinds of composite materials were studied,and the composite wires suitable for forming circuit were selected to add the functionality of fused deposition parts.The electronic devices and embedded components with double nozzles were fabricated by melt deposition.The process of creating complex three-dimensional circuits including embedded and fully formed electronic components by melt deposition molding machine is promoted.By analyzing the error sources in the process of fused deposition molding,the main error sources are determined to be the process parameters and machine motion chain,including the errors caused by molding temperature,layer thickness and filling density,as well as kinematic errors.Considering the errors from different factors,a comprehensive error model is established to analyze the change trend of each error.The error compensation model is established by using the inverse integral function of comprehensive error.The error of the uncompensated model and the compensated model is compared through the experimental data.Through the analysis of the compensation results,it is found that all the errors have decreased,and the x-axis is the most obvious,which proves the effectiveness of the error compensation model.Fused deposition molding is a complex process.Different process parameters should be used for 3D circuit manufacturing.Therefore,a model group division hybrid slicing process is proposed,and the conversion between G codes of different materials is studied when two kinds of consumables are mixed printing,and the integrated forming of stereo circuit is carried out,which can realize highly flexible and customized hierarchical processing of stereo circuit for different applications.Experiment of fused deposition forming stereoscopic circuit.Based on the analysis of the influence of process parameters on the redistribution of nano copper in the molded parts,the optimal process parameters were obtained by taking conductivity as the objective;In this paper,a new method of fabricating stereoscopic circuit based on melt deposition molding technology is proposed.The optimal process parameters are used to print the conductive part of stereoscopic circuit.On the basis of studying the influence of the cross-section shape and area of circuit geometry model on the conductivity of circuit,the stereoscopic circuit is directly fabricated by using composite wire melt deposition molding technology,realize the one-time forming manufacturing of parts and circuits.