Research On Controllable Grinding Mechanism And Process Technology Of Monocrystalline Silicon Lens

With the rapid development of optoelectronic technology at home and abroad,the requirements for high-precision optical elements are increasing,so are the requirements for their manufacturing accuracy.However,there is still a lack of in-depth research on the formation mechanism of surface roughness in the grinding of aspheric components.The research of aspheric machining technology is still immature,the machining accuracy and efficiency are difficult to guarantee,and there is no corresponding theoretical guidance for the selection of aspheric machining methods.In this paper,the controllable grinding mechanism and process technology of infrared monocrystalline silicon lens are studied.The main contents are as follows.(1)The material deformation and removal characteristics of monocrystalline silicon at the micro scale were studied through micro scratch experiment and Raman scanning experiment.A two-dimensional model of single abrasive grinding of monocrystalline silicon material was established by using the finite element method.The brittle removal process of monocrystalline silicon was simulated,and the influence of grinding speed and abrasive grain angle on the machined surface quality was studied.(2)The surface roughness model of monocrystalline silicon lens grinding was established aimed at the normal grinding method of aspheric surface.The model takes into account the geometric and kinematic characteristics and the scratch overlapping factors in the machining process of aspheric elements.Finally,the influence of machining parameters and grinding trajectory on the surface roughness was given,and the model was verified by the grinding experiment of monocrystalline silicon.(3)Based on the force analysis of single abrasive,the mathematical model of grinding force for aspheric machining was established.The influence of wheel rotation speed,workpiece rotation speed and grinding depth on grinding force were studied.The tangential grinding force in the grinding process was obtained indirectly by measuring the load torque of the spindle,so the tangential grinding force model could be verified by experiments.(4)Research on grinding process of monocrystalline silicon aspheric lens was carried out.The vertical axis grinding method and the normal grinding method were used to carry out the aspheric surface grinding experiment.The orthogonal experiment method was used to study the influence of the technological parameters such as the wheel rotation speed,grinding depth and feed speed on the surface roughness and material removal rate of the aspheric surface grinding.The experimental results of the vertical axis grinding method and the normal grinding method were compared and analyzed and the different characteristics and application occasions of the two processing methods were discussed.In this paper,by analyzing the micro scale material removal mechanism of monocrystalline silicon,establishing the mathematical model of the surface roughness and grinding force of machining aspheric surface,and carrying out the research on the optimization of the technological parameters of the aspheric surface grinding,the machining mechanism of monocrystalline silicon aspheric components was more deeply understood,which provides a theoretical guidance for the controllable and efficient machining of monocrystalline silicon aspheric components.