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Optimization Design Of Micro-channel Heat Sink For Phased Array Antenna

Posted on:2021-02-19Degree:MasterType:Thesis
Country:ChinaCandidate:L M YinFull Text:PDF
GTID:2492306311971489Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
With the increasing integration of phased array antennas,the problem of heat dissipation caused by high heat flux density and small space has become increasingly prominent.It is mainly manifested in two aspects:on the one hand,the high heat generated by the phased array antenna may cause burnout of components if it cannot be removed in time;on the other hand,when the temperature of the chip such as the power amplifier of the phased array antenna T/R module When it is not uniform,the amplitude and phase of the operation of each channel will be inconsistent,and eventually the overall telecommunication performance of the antenna will be reduced.At present,traditional cooling methods such as air cooling and liquid cooling cannot meet the heat dissipation requirements of the new generation of active phased array antennas.In recent years,the cooling effect of the emerging microchannel heat dissipation technology is better than that of general cooling methods.The cooling capacity of the liquid cooling device using a micro-channel heat sink can easily reach hundreds of watts per square centimeter,which has become one of the most promising technologies to solve the heat dissipation problem of high-density active phased array antennas.Therefore,it is a research issue with important practical application value to configure the microchannel heat sink’s structural parameters and flow parameters according to the heat dissipation requirements of active phased array antennas and some practical constraints.According to the cooling requirements of phased array antenna cooling and temperature uniformity,this paper studies the heat dissipation design method based on microchannel heat sink.The specific research work is as follows.(1)Based on the shortcomings of the current domestic and foreign microchannel heat sink optimization design methods,a parallel Bayesian optimization algorithm based on transfer learning framework is proposed.This algorithm improves the serial Bayesian optimization algorithm of the transfer learning framework based on single-point iterative optimization to parallel multi-point iterative optimization,which can greatly improve the efficiency of algorithm optimization.The theoretical basis and parallel improvement process of the parallel Bayesian optimization algorithm for integrated transfer learning mentioned in this paper are described in detail.Two numerical test examples and a microchannel heat sink optimization example verify the efficiency and accuracy of the optimization method.(2)According to the cooling requirements of phased array antenna cooling and temperature uniformization,a new structure microchannel heat sink with an inverted T-shaped coolant distributor was designed.By comparing and analyzing with the traditional structure of the microchannel heat sink,it is proved that the new structure of the microchannel heat sink proposed in the text has the advantage of temperature uniformity.In addition,the above-mentioned optimization design method is used to further optimize the novel microchannel heat sink proposed in this paper.The optimization results show that the optimized flow,pressure drop,and pump power have decreased by 56.8%,69.8%,and 86%,respectively,compared to the results of the preliminary design when the heat dissipation performance of the heat sink is relatively small.According to the results of the optimized design,a microchannel heat sink experimental prototype was fabricated and tested.The experimental test results showed that the temperature error of the heat source on the surface of the heat sink in the simulation and experimental tests was within 6.8%,indicating the simulation Design results are highly consistent with experimental results(3)According to the heat requirement of a high-density active phased array antenna,the heat dissipation system is designed in detail.First,the layout of the cooling layer of the whole machine is discussed through two schemes,and then the scheme of the microchannel heat sink of the whole machine is designed according to two different application scenarios.On the basis of studying the quality of microchannel 3D printing,the channel is optimized.Finally,according to the results of the optimized design,a sample of heat sink was fabricated by metal 3D printing technology.
Keywords/Search Tags:Micro-channel Heat Sink, Parallel Bayesian Optimization Algorithm, Temperature Uniformity, Inverted T-shaped
PDF Full Text Request
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