Preparation Of Micro Self-destruction Chip Based On Nanothermite

In order to protect the safety of data stored in electronic components,the self-destruction technology of electronic components has become a research hotspot.The current self-destruction technology requires changing the microstructure of electronic components and redesigning their architecture to match the requirements of self-destruction energy,and also has the problems of complex preparation process,high cost,long cycle time and poor reliability,which is not universally applicable.Energetic materials with controlled triggering,fast energy release and powerful destructive properties are well suited to meet the self-destruction requirements of electronic components.Compared with the traditional energetic materials of C,H,N and O,the nano-thermite shows a good application potential in military fields such as micro energetic devices,rocket propellants and green initiating explosive agents because of its ultra-high reaction combustion rate and energy release rate,high bulk energy density,low diffusion distance and green environmental protection.However,there are problems such as difficult ignition and insufficient pressure in the application of nano-aluminum thermite for the micro self-destruct chip,and therefore needed to develop a high performance nano-thermite to finally obtain an energetic micro self-destruct chip with easy preparation process and high reliability.Focusing on the problems of high ignition threshold and low combustion pressure of nano-thermite,this paper optimize the components of oxidizer and reducing agent through element doping,and develop a nano-thermite with easy ignition and high temperature and pressure characteristics.Further,the micro self-destruction chip based on Al-Ti/Cu Bi₂O₄nano-thermite was developed by improving the integration process of nano-thermite powder with a perspective of realizing the application of nano-thermite in self-destruction of electronic devices.The main research contents and results are as follows:1.To address the problem of high ignition energy for aluminum nanothermal agent,titanium(Ti)nanoparticles were doped in the reductant component and a series of Al-Ti/CuO multilayered films with different Ti doping concentrations were constructed by suction filtration.The laser ignition test revealed that the addition of Ti nanoparticles reduced the ignition threshold of Al/CuO multilayered films.The ignition threshold of the multilayered films with 20 wt%Ti addition was only 21.2 m J,which was only 63.6%that of Al/CuO.Further analysis of the exothermic process and chemical structure of combustion products by DSC,XRD and XPS showed that Ti nanoparticles promote an alloying reaction via Al(402.2-461.2?).This exothermic reaction accelerates the thermite reaction process,thus decreasing the ignition threshold of the multilayered structure.However,the combustion process is significantly weakened with the excessive addition of Ti nanoparticles,which shown that appropriate Ti nanoparticles can be used as a metal fuel to effectively reduce the ignition difficulty of the nano-thermite.2.With the help of the bimetallic synergistic,the bimetallic oxide Cu Bi₂O₄was prepared to develop a new type of nano-thermite.Cu Bi₂O₄releases large amounts of metal Bi vapor in the aluminothermic reaction,increasing the gas production and boosting the pressure output.In the temperature measurement and combustion pressure experiments,Al-Ti/Cu Bi₂O₄nano-thermite showed excellent high temperature properties(2187?),and rapidly pressurization rate(0.1706 GPa·s^-1).The Al-Ti/Cu Bi₂O₄nano-thermite showed the characteristics of high temperature and high pressure,which made energetic materials to meet the transient energy demand of self destruction system.3.The Al-Ti/Cu Bi₂O₄nano-thermite was prepared into an energetic film with binder by the nitrocellulose.In addition,heat release and ignition of Al-Ti/Cu Bi₂O₄nano-thermit were tested.Furthermore,the Al-Ti/Cu Bi₂O₄energetic film was integrated on the semiconductor bridge by the drop-injection method to obtain the Al-Ti/Cu Bi₂O₄micro self-destruction chip.The actual micro self-destruction process is simulated by using a direct current power supply,and the whole self-destruction process can be completed within 3 ms.This study lays a foundation for the development and application of micro self-destruct chips.