Preparation Of Functional Silicone Photosensitive Resin And Its Application In 3D Printing

Light-curing 3D printing has fast molding speed and high printing accuracy,and is widely used in the 3D printing industry.With the maturity of equipment and processes,the requirements for the performance of photosensitive resins are gradually increasing.The development of high-performance photosensitive resins limits development of light-curing 3D printing.The organosilicon main chain structure is mainly composed of siloxy chain links,and organic groups are connected to the side chains.This unique structure gives it the advantages of organic-inorganic two-phase,due to its excellent characteristics,such as temperature resistance and weather resistance Silicone materials are widely used in construction,food,aerospace,medical,electronic and electrical industries.Combining the advantages of silicone with UV curing,products with different properties can be developed according to needs.Functional modification of the organic functional groups on the surface of the organosilicon can produce functional organosilicon resins.(1)Synthesize a silicon-containing quaternary ammonium salt monomer(Si-QAS)with choline chloride,isophorone diisocyanate(IPDI)and 3-aminopropyl-methyl-diethoxysilane as raw materials,and then used this monomer and 3-methacryloxypropyltrimethoxysilane(KH570),dimethyldimethoxysilane and tetraethyl orthosilicate(TEOS)to synthesize a new type of organic Silicon quaternary ammonium salt(UV-Si-QAS),combined UV-Si-QAS and 3D printing photosensitive resin,printed on a DLP 3D printer,and discussed the antistatic and antibacterial properties of the quaternary ammonium salt on the material.The research results show that when the amount of UV-Si-QAS added is 16%,the resistance of the material drops from 10¹³?to 10⁹?,and the antistatic effect is not significantly weakened with the increase of use time;when the amount of UV-Si-QAS added is 8%,The antibacterial efficiency of glucococcus aureus reaches more than 91%,and there is no obvious change in the mechanical and thermodynamic properties of the material;the photosensitive resin itself has an inhibitory effect on escherichia coli.(2)Silica sol was prepared by sol-gel method.Tetraethyl orthosilicate(TEOS)was used as precursor of inorganic phase,and gamma 3-methacryloxytrimethoxysilane(KH570)was used as precursor of organic phase,trimethylolpropane triacrylate(TMPTA).Four The organic/inorganic hybrid silica sol was synthesized by hydrolysis condensation reaction using TMPTA as solvent of silica sol and light curing active diluent under the catalysis of strong acid type ion exchange resin membrane.The organic phase contains light curable acrylate group.The inorganic phase is Si O₂nanoparticles.Firstly,the effect of raw material ratio on the synthesis of silica sol was explored.After selecting the best synthesis ratio TEOS:KH570=1:3,the synthesized silica sol was added into the prepared photosensitive resin to prepare the composition for UV curing 3D printing.The results show that the tensile strength of the composite increases from 32.61mpa to 41.22mpa when the silica sol content is 8%,the curing shrinkage of the composite decreases to 7.214%and the water absorption is 0.748%when the silica sol content is 16%,and the thermal stability is improved.