Preparation And Properties Of Three-dimensional Carbon/Epoxy Composites

With the rapid development of economy and society,humans have entered the information age,and equipment has also tended to be miniaturized and integrated.Therefore,a large amount of heat will be generated during use process.If it cannot be discharged in time,it will seriously affect the normal operation of the equipment,so heat conduction material research and development has gradually become a research hotspot in recent years.Epoxy resin(EP)is widely used in various fields as a polymer material because of its good performance,but its low intrinsic thermal conductivity severely limits its application in the field of thermal conductivity,so it is significant to improve the thermal conductivity of epoxy resin.In this paper,a three-dimensional carbon(3DC)material with a controllable structure was prepared using salt template-assisted reduction CVD method and used as a thermally conductive filler to improve the thermal conductivity of epoxy resin.Through systematic analysis,the effects of process parameters on morphology,structure and intrinsic thermal conductivity of the 3DC were studied,and the best process parameters were also established.The effects of 3DC structure and content on the thermal conductivity of three-dimensional carbon/epoxy resin(3DC/EP)composites were also discussed.At the same time,the hardness,wear resistance and moisture absorption behavior of 3DC/EP composites were studied.The results show that the intrinsic thermal conductivity of the 3DC prepared by calcining under the argon gas condition with a Na:C molar ratio of 100:20 is the best,and the thermal conductivity of the epoxy resin has the best improvement effect.The thermal conductivity of3DC/EP composite materials increases with the increase of 3DC content.Besides,the addition of 3DC significantly improves the hardness,wear resistance and moisture resistance of epoxy resin.Therefore,3DC is a low-cost,good-performance thermally conductive filler,and has important potential application value in the field of thermally conductive materials.