Analysis Of Anti-sulfidation Performance Of Silver Alloy Bonding Wire And Its Application In LED

With the development of integrated circuits and semiconductor devices towards high density,high integration and miniaturization.The performance and cost of semiconductor packaging has become a hotspot of technological competition,especially the quality of electrical interconnection determines the performance of semiconductor products,as the most widely used method of electrical interconnection-wire bonding,can be achieved between the chip and the lead frame stable and reliable electrical interconnection,its welding usage rate in semiconductor components reaches more than 80%.This paper adopts a new type of automatic continuous passivation technology to treat silver alloy bonding wires in order to obtain a high-density,uniformly coated,mass-producible anti-sulfide silver alloy bonding wire.This anti-sulfide passivation protective layer does not affect The application of silver bonding wire in actual packaging and packaging.This article discusses the effects of passivation current,passivation liquid composition and passivation time on the anti-sulfurization effect of silver alloy bonding wire.The process improvement process takes the actual packaging application EFO ball effect as the expected target of the passivation process program adjustment.In this paper,based on the verification effect of EFO burned ball,the DOE experiment was designed to verify the best parameter range of its EFO burned ball.The surface structure,composition and film thickness information of the passivation film were analyzed by SEM,EDS and TEM;silver sulfide for optimized process alloy bonding wires are used for actual LED package reliability analysis,including extension-break test,push-pull test,thermal shock test,LED lamp bead vulcanization test,etc.,comparing passivation anti-sulfide bonding wire with untreated silver alloy Application differences between bonding wires.The results showed that the surface of the silver bonding wires are evenly covered with a smooth and dense passive film,TEM showed that the thickness of the anti-sulfidation passive film was about 3 nm which provides excellentanti-sulfidation performance,lumens reached 123.45 lm which is increase of1.2% over untrated in LED package,lumen increased by 1.1% compared with unpassivated silver bonding wire after sulfidation test.At the same time,the Free Air Ball shape and welding mechanical properties were basically the same compare the untreated silver bonding wire.Therefore,passivation process is a method to solve the application of anti-sulfidation of silver alloy bonding wire.