Study On Microstructure And Properties Of Cu/Mo Electronic Packaging Materials By Rolling

Cu/Mo laminated composite materials are used as electronic packaging materials in electronic industry due to its high strength,impact property,the coefficient of thermal expansion and thermal conductivity can be designed by changing the thickness of copper and molybdenum layer.In this paper,Cu/Mo electronic packaging materials were fabricated by hot-rolled&cold-rolled bonding process.The effect of rolling conditions on microstructure,mechanical properties and thermal conductivity of composite materials had been investigated by optical microscope(OM),scanning electronic microscope(SEM),universal electronic tensile machine,laser thermal analyzer etc..The results showed that,the hot-rolled composites have the best mechanical properties when the rolled temperature reached 750?and the deformation rate was 60%,the transverse and longitudinal tensile strength were 572.4 MPa and 434.1 MPa,the elongation were 11.4%and 8.6%respectively,its'bending strength was 1116.88 MPa;The hot-rolled composites got through the cold rolling after 40%?80%cold-rolled deformation rate,its'tensile strength,bending strength and micro-hardness of composites increased and elongation decreased with this processes,tensile strength of composites were between577 MPa and 641 MPa,the bending strength were between 1174 MPa and 1351 MPa,the elongation decreased from 7.8%to 3.3%,and the fracture mode copper layer was ductile fracture and molybdenum layer was layered fracture.After 400?×1 h annealing treatment,tensile strength and bending strength were decreased,but the elongation and the thermal conductivity increased.Cu/Mo layered composite materials measured value was lower than the calculated value,thermal conductivity was declined with temperature rising in different temperature,but it increased after cold rolling,the vertical direction of thermal conductivity was between 166?200 W·m^–1·K^–1.