The 3D Volume-to-point Thermal Conductivity Problem

The volume-to-point(VP)problem describes how to construct a high thermal conductivity materials for a specific heat producer to efficiently transfer the heat in the volume to a designated location(point)so that the temperature of the heat producer can meet the requirements.In order to minimize the average temperature of the whole field and improve the thermal conductivity efficiency,the minimal surfaces method and bionic optimization method are proposed and proved respectively for the bottom opening model and vertical hollow model of 3D VP thermal conductivity problem.Based on the temperature field obtained by heat conduction equation,the above two methods are numerically simulated,and the filling scheme and optimized temperature field of high thermal conductivity materials are obtained by programming.The effects of the two filling methods,different steps and dimensions of the same method are compared and analyzed,and the results show that the two 3D methods are reasonable and effective,it plays an important reference role in the thermal conductivity optimization of components.