Research On Laser Microhole Machining Technology Of Aluminum Oxide Ceramic Thin Plate Based On Quasi-Continuous Laser

Alumina ceramics is an inorganic non-metallic material with brittle and hard characteristics.With the vigorous development of my country’s electronic industry,the demand for micropore processing of this material is gradually increasing.Because alumina ceramics are highly hard and brittle materials,traditional machining methods and special machining methods are very easy to cause cracks or even breaks in the workpiece,and the rejection rate is high,and it cannot meet the accuracy and efficiency requirements.As a non-contact processing method,laser processing is very suitable for processing materials with high melting point,high brittleness and high hardness,and it has good processing accuracy,processing efficiency and processing flexibility.It is very good in alumina ceramic micro-hole processing.Application prospects.When laser processing micro-holes on the order of micrometers,problems such as poor surface quality,low processing efficiency,and thick recast layers often occur.This article is based on the various characteristics of quasi-continuous fiber lasers,such as: unique dual laser mode,high peak power when switching pulse mode,excellent beam quality,etc.,for laser processing of micro-holes with a radius of 50μm on the surface of a 96 alumina ceramic sheet The relevant process,quality analysis,and parameter optimization of the company are explored to solve the problems that often occur in laser drilling and provide a theoretical basis for its industrial application.The main conclusions of the full text are as follows:(1)Through the comparison of laser micro-hole processing technology,it is found that different drilling technology methods have a greater impact on the efficiency,aperture,roundness,heat-affected zone and other quality issues of laser processing of micro-holes with a radius of 50μm;for ceramic sheets of different thicknesses,Choosing a suitable laser mode can effectively simplify the pre-treatment process and improve the topography of the section;on this basis,a process method and laser mode suitable for processing micro-holes with a radius of 50μm are proposed.(2)Through the analysis of laser micro-hole processing quality,it is found that the relevant processing parameters involved in laser rotary cutting method drilling include the number of rotary cutting cycles,the number of rotary cutting,the rotary cutting speed,and the characteristic size and morphology of the micro-hole with a radius of 50μm.The characteristics have a certain regularity influence;on this basis,the processing parameters of the rotary cutting method suitable for processing micro-holes with a radius of 50μm are proposed.(3)By optimizing the laser parameters of laser micro-hole processing,it is found that a variety of laser parameters,including pulsed laser duty cycle,defocusing amount,auxiliary side blowing compressed air pressure,laser scanning speed,pulsed laser repetition frequency,and the processing radius The entrance and exit aperture of 50μm micropores has obvious regular influence;on this basis,through orthogonal experiment design,the comprehensive effect of multiple laser parameters is obtained,and the optimal drilling parameter combination is obtained.