Thermofluid simulation analysis of a high heat flux integrated chip using micro-jet and micro-channel liquid flow

Demand for high performance liquid cooling of integrated chip structure is growing due to increased heat generation and high flux associate with the miniaturized and higher density integrated circuits in chip used in number of electronic devices. The A combined integrated micro-jet and forced convection cooling of high heat flux integrated chip is considered in this study. The cooling scheme involves impinging jet convection followed by single or two phase flow boiling convection through adjacent integrated micro-channels. A computational fluid dynamics model is developed to analyse the fluid flow and heat transfer characteristics in terms of flow and temperature distributions, pressure drop, and volume fractions using STAR CCM+. The computational two-phase homogeneous flow boiling model is validated by comparing results with available two-phase boiling correlation. A sensitivity parametric study is conducted also to explore the effect of micro-channel geometry and size; nozzle size and number; and flow conditions.