| The behavior of impurities (in particular arsenic, antimony and bismuth) on copper electrodeposition was investigated using several non-steady state techniques at a temperature of 63{dollar}spcirc{dollar}C in cupric sulfate solution (Cu 45 g/l, H{dollar}sb2{dollar}SO{dollar}sb4{dollar} 200 g/l). As a result, group-V elements work as depolarizers against copper deposition and hydrogen evolution. From the result of cyclic voltammetry, copper reduction was subject to an irreversible reaction with a preceding chemical reaction. In general, copper deposition is not significantly effected by group-V impurities at the compositions investigated. Basic electrochemical parameters, except for the transfer coefficient, were also insensitive to these impurity constituents. However, there is a peak due to arsenic reduction (at {dollar}-{dollar}0.330 V) in cyclic voltammogram for the As-containing electrolyte.; In addition, the effect of impurities on morphologies were investigated by SEM observation and X-ray diffractometry. As a result, group-V promoted truncated deposits and the (110) crystallographic orientation. |
