| Long wavelength tunable transmitters are essential in the field of optical communications. Wavelength control and cost reduction are very important issues, especially in applications such as wavelength division multiplexing (WDM) networks, where several closely spaced wavelengths are transmitted and processed simultaneously. This thesis introduces a transmitter design that can alleviate these problems. This work involves the development, fabrication, and characterization of a narrowband tunable resonant cavity light-emitting diode (LED). The emission is centered at 1.51 {dollar}mu{dollar}m, an important wavelength for optical communications. The linewidth is only 4 nm and the tuning range covers 75 nm.; Wafer bonding and surface micromachining techniques have been integrated in the design to produce a structure that combines the assets of each technology. Wafer bonding is used to build the base for a vertical cavity surface emitting laser (VCSEL) structure, which is composed of an InP-based active layer on a GaAs-based mirror. Surface micromachining is then used to fabricate the suspended top mirror of the VCSEL, in place of the traditional top mirror that is grown directly on the VCSEL structure. The suspended mirror moves towards the substrate with the application of a voltage, thus changing the Fabry-Perot cavity length and providing the wavelength tunability of the device.; This transmitter design relaxes the need for preset wavelengths in VCSEL processing by allowing the user to adjust the central wavelength after processing. Arrays of transmitters with identical wavelengths for high power applications or with gradually decreasing emission wavelengths across a wafer can also be achieved. The tunability of the devices allows for real time wavelength monitoring and tracking to ensure stability of the wavelengths with temperature or environmental changes, as well as compensating for shifts in wavelength due to degradation of the devices over time. Due to the monolithic, vertical cavity design, the device has important applications in spectroscopy and optical information processing as well. In addition, the planar processing of the devices makes possible wafer scale fabrication and testing which allows for low cost production, an essential component of manufactured products. |
