A time domain reflectometry method of IC package characterization for surface-mount devices

Currently, accurate models of digital ICs are one of the most crucial parts of today's design cycle. Digital designers are increasingly relying on accurate computer simulation to reduce development cost and time-to-market. To achieve the highest degree of accuracy, circuit simulation programs must have accurate device models. As recent technological advances have pushed the speed at which ICs operate, the IC package has become a performance-limiting factor. Accurate package characterization has become a prerequisite for accurate device models. This report outlines a comprehensive method based on Time Domain Reflectometry for the characterization of surface-mount leadframe-type IC packages.