Optimization and reliability of electronic packages

This thesis discusses the reliability and design optimization of a generic Printed Wiring Board (PWB) level chip scale package under thermal cycling loads. Darveaux's Constitutive relations for eutectic solder and Darveaux's Methodology for calculating fatigue of solder joints are adopted successfully in the model for the analysis. Finite element tool ANSYS is used to estimate the cycles to fatigue failure of solder joint of the package coupled with Optimization module present in ANSYS for providing the details on determining optimal design parameters which affect the product reliability. Combining finite element analysis with optimization would significantly reduce the design time and increases the product reliability.; Four model characteristics are chosen as the optimization inputs that ensure higher reliability and improved performance of the assembled product. Sub-problem approximation, Design of experiments and Central Composite Design Methodology are used to study the effects of each design variables on the fatigue life.