| Conductive adhesive technology has attracted more and more attention of the electronics industry. The new technology offers numerous advantages over traditional soldering technology. However, some critical limitations of this technology have slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. Fortunately conductive adhesive technology has advanced significantly. The purpose of this thesis was to explore the effects of novel additives on the electrical conductivity and their effect on the contact resistance during humidity aging (85°C/85RH). The additives used in the present study included various conductive additives and corrosion inhibitors. The effect of these additives was analyzed using an in-house conductive epoxy formulation. It was observed that the addition of 1.8% by volume of 2-Hydroxyquinoline, 6-Hydroxyquinoline and combination of 8-Hydroxyquinoline & N-Hydroxysuccinimide gave stable contact resistance during 85°C/85RH aging. Replacing part of the silver with other conductive additives resulted in lower electrical conductivity. |
