Characterization and comparison of creep properties for tin-indium-silver solder joints

Posted on:1997-05-20

Degree:M.S

Type:Thesis

University:The University of Arizona

Candidate:Seddon, Michael John

Full Text:PDF

GTID:2461390014481085

Subject:Engineering

Abstract/Summary:

n the search of a lead-free solder for use as a replacement of the current tin/lead solders, an alloy consisting of 77.2% tin, 20% indium, and 2.8% silver has been invented. This solder, entitled Indalloy...

Keywords/Search Tags:

Solder

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