Toughening of Epoxies: Novel Self-Assembling Block Copolymers Versus Traditional Telechelic Oligomers

Epoxy resins are commonly utilized because of their adhesive capacity and high strength. However, epoxies are inherently brittle; so much research has been dedicated to improving their fracture toughness. This study will focus on a comparing a traditional telechelic oligomer, CTBN, and a novel self-assembling block copolymer, SBM, as it relates to improving the fracture toughness of a lightly crosslinked epoxy system.;After characterizing the modified systems for fracture toughness, mechanical and thermal properties, namely yield stress and the glass transition, will be determined in order to discern the impact these modifiers have on the overall properties of the blend. TEM, SEM and TOM techniques will be utilized for characterizing morphology, fractography and subsurface damage, respectively.;Once this was accomplished, it was deduced that the toughening mechanisms of CTBN and SBM-modified epoxies are very similar. The main difference between the two is that the inherent structure of SBM allows the SBM-modified epoxy to retain its compressive yield strength. This, consequently, makes SBM ideal for thin bondline applications in the industrial adhesive and/or electronics industry.