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Technology development for heterogeneous integration of silicon electronic devices using directed fluidic self-assembly

Posted on:2005-12-24Degree:Ph.DType:Thesis
University:Purdue UniversityCandidate:Lee, Sang WooFull Text:PDF
GTID:2458390008981413Subject:Engineering
Abstract/Summary:
In this thesis, fluidic self-assembly techniques are presented that utilize electrophoresis, dielectrophoresis, electrohydrodynamics and related methods for assembling single-crystal silicon devices suspended in a fluid onto a binding site on a heterogeneous substrate. Different model systems were used to develop key aspects of the technology. The assembly of commercially available negatively charged micro-scale polystyrene beads was characterized using interdigitated electrodes. Single-crystal silicon islands with gold/chromium contacts and silicon blocks without the metal contacts were fabricated on bonded & etched-backed silicon-on-insulator (BESOI) wafers. The silicon islands fabricated on a BESOI wafer were functionalized by 2-mercaptoethansulfonic acid sodium salt, 4 nucleotide thiolated-ssDNA. The functionalized islands and non-functionalized blocks were released in DI water and then assembled on a different substrate by electrophoresis or dielectrophoresis and electrodynamics.; Two terminal silicon resistors were fabricated, released in a fluid and assembled on different substrates. Finally three terminal MOSFETs were designed and fabricated on BESOI wafers, successfully released in DI water, and then subsequently assembled on a different substrate at specific binding sites by dielectrophoresis and electrohydrodynamics. Process flow, fabricated challenges, and electrical characteristics of the assembled silicon will be presented and future work will be discussed.
Keywords/Search Tags:Silicon, Fabricated, Assembled
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