| Finned passages are frequently formed between parallel plates to increase convection heat transfer for compact heat exchanger cores. This increment is possible because compact heat exchangers are designed to provide a large surface area per unit volume. An important application of this procedure is in electronic equipment cooling, where one or more compact heat sinks are placed between heat-dissipating electrical components. The computer industry is one of the leading fields developing this type of cooling techniques. As technology evolves, this industry has been able to create better microprocessors that generate large amounts of heat. This increment in power and the low thermal properties of air are making their conventional cooling technique using air an outdated method. The aim of this work is to introduce, determine and compare the behaviors of two indirect liquid cooled micro-channel single chip designs with a circular and a rectangular profile. The rectangular design will be developed using specifications from a well-known design introduced by Tuckerman and Pease. The circular design will be a modification of their previous design. These models where created and analyzed in a three-dimensional coordinate system. The commercial program that was used to analyze these two designs is known as MATLAB. This program evaluated their temperature distributions, surface comparisons, weight relationships and pump power among other values. The purpose for comparing these values was to determine if for VLSI chips the circular design could work just as well as the rectangular design, while maintaining smaller geometry components. |
