| The present study develops a heat exchanger for cooling of high-power microelectronics. Experiments on flow boiling of FC-72 are carried out in screen laminate test articles having a wire diameter of 0.43 min. One and 3-layer laminations (t = .86 mm and 2.29 mm, respectively) are tested with sub-cooling (DeltaTsub = Tsat-Tin) ranging from 2K to 10K; superheat (DeltaTsub = Tbase-T sat) ranging to 120 K: and, flow rate over the mesh Reynolds number range, 40≤Re≤500. Data shows that approximately 250 W/cm2 of heat flux can be dissipated from the base of the screen with 120 K superheat. With the same sub-cooling, screen base heat fluxes increase with an increase in flow rate and superheat. When the screen thickness increases, transverse conductance increases and improves the boiling performance. With a fixed superheat and sub-cooling, a 2.5-fold increase in base heat flux and effective conductance is observed with two-phase flow over single-phase flow. |
