Analysis of heat dissipation in electronic packages using CVD diamond substrate

The purpose of this study was to evaluate the potential of combining the evaporative spray cooling with CVD synthetic diamond substrate to be used in high power electronic or radar system to rapidly remove heat passively. Nowadays, electronic systems are getting smaller in size and so thermal management in electronic becomes critical even as early as in the design stage. An electronic package consists of various materials that have different thermal coefficient of expansion (CTE), so material CTE mismatches due to power or thermal cycling is inevitable especially in the package and the component levels. It is diamond that has the tailorable CTE capability between the package and the printed circuit board (PCB) that provides rapid heat dissipation from the high-density power device. When the device is thermally loaded, the possibility of device failure due to overheat will be eliminated. For active cooling substrate media, diamond is capable of providing the ideal thermal conductivity, thermal expansion and is electrical insulated. The addition of active cooling method together with the passive cooling of diamond heat spreader will definitely enhance the heat removal rate on high heat electronic today.