Fundamentals of multiphase, gas-solid and gas-liquid flows in porous media

This thesis is concerned with fundamentals and applications of multiphase and particulate flows. The study contains three parts covering gas-liquid flows through porous media, gas-solid flows and Chemical-Mechanical Polishing (CMP).; A continuum model for multiphase fluid flows through poro-elastic media is developed. It is shown that the present theory leads to the extended Darcy's law and contains, as its special case, Biot's theory of saturated poro-elastic media. The capillary pressure formulation derived from the new model is used and the equation governing the evolution of the saturation and its temporal variation in porous media is derived. The resulting nonlinear diffusion equation is then solved numerically. The results show that the capillary hysteresis occurs when the temporal variation of saturation is included. Application of the developed model to CO₂ sequestration is discussed.; Computer simulations of dilute Gas-Solid flows in complex geometry regions are studied. A procedure for handling particle trajectory analysis in unstructured grid is developed. Examples of particle transport and removal in human lung and hot-gas cleaning systems are presented. The simulation results for the human lung show that the capture efficiency is affected by the turbulence in the upper three bifurcation airways. Computer simulations of gas-solid flows in hot-gas cleaning for a demonstration scale filtration system is studied in details. Alternative designs of the filter vessel are proposed. The corresponding vessel performance are numerically simulated.; Chemical mechanical polishing (CMP) has become critical to the fabrication of advanced multilevel integrated circuit in microelectronic industry. The effect of course surface roughness of abrasive particles on the polishing rate in CMP is studied. The effects of slurry pH and double layer attraction and repulsion on chemical-mechanical polishing are also studied. It is shown that the slurry pH and colloidal forces significantly affect the removal rate in chemical mechanical polishing.