| The objective of this research is to study the debonding effects on solder joints between the substrate solder ball joint and the adhesive, when subjected to a constant temperature.; The case of interest in this study is a 196 solder Intel solder ball joint. The growth of crack was studied by fictitiously inserting a crack region on the center solder joint for Square Module and Hexagonal Module.; The crack size considered in this study is .25r, r, and 2r with r as the radius of contact circle between solder joint and substrate.; Post-processing results have conclusively shown that the stress, strain energy release rate developed on a hexagonal solder joint array were higher than the square solder joint array. |
