| High temperature MEMS pressure sensor packaging demands much more requirements for packaging process than common pressure sensors. The choice of material for high temperature MEMS pressure sensor is an important issue. Some previous researches concentrated on a SiC MEMS pressure sensor chip. However, the researchers from Concordia University recently found that SiCN had important advantages over Si or SiC at high temperature and would be a potential material in harsh environment. In this thesis, a brief background about high temperature MEMS sensor is introduced. Some issues in the material choice, fabrication, packaging, and application of high temperature MEMS sensor are discussed. Two kinds of methods for packaging high temperature pressure sensors are designed to create prototypes and the designed prototypes are evaluated under the sensor working condition. In addition, some simulations for those designed prototypes are studied and the results of simulations are discussed. |
