| The use of new technology in the field of microelectronics has made life much easier. More and more people have been using portable telecommunication devices such as mobile phones, personal digital assistances, laptop, personal computers, etc. It is very common for those portable electronic products to be accidentally dropped onto the ground. It may not only cause mechanical failure in the housing, but can also cause the electrical failure in the printed circuit board (PCB). The shock waves caused by the drop are transmitted to the PCB assembly through the supports, and then the PCB starts vibrating, which causes board flexure. The vibration develops tensile stresses in soldier joints and interconnects, which causes the failure of the electronic packages and malfunction of the products. The failure of such a product is due to the non-uniform strain distribution on the board due to the drop.;In this thesis, the block diagram based SIMULINK analysis is introduced to determine the response with various impact configurations. Using SIMULINK, the relationship between input and output can be obtained and visualized easily as a function of system parameters. The drop impact response analysis helps the reliability engineers to design the impact input profiles and obtain the desired responses. The time duration of input profile plays an important role in the dynamic response. The system response can be designed by carefully choosing the impact time duration. |
