| Launching a projectile generates severe shocks, which can result in the malfunction of electronic components within the device. The reliability of these components is related to the mode shapes, natural frequencies and the dynamic deflection of the Printed Circuit Boards. Structural vibration analysis of Printed Circuit Boards and their electronic components can be performed using both Finite Element Methods and vibration test. This study presents the effect of shock and the structural response of the electronic components within the projectile. The results are verified by experimental and modal analysis. |
