| The research presented in this thesis investigates the use of glancing angle deposition to fabricate thin films with structural periodicity in the substrate plane. One-dimensional (1D) substrate topography was utilized to create sub-micrometer coherent ribbon structures, which are of potential use for sensor devices, nano-photonic structures, and angularly selective window coatings. Partial delamination of the ribbon structures was demonstrated, suggesting that ribbons of arbitrary length can be fabricated and removed from the substrate intact.;A numerical model was developed to predict the interstitial deposition fraction under variation of various parameters, including vapour incidence angle, seed shape and seed geometry. The numerical model produced good agreement with the experimentally observed interstitial deposition fractions.;Fabrication of 2D-3D photonic crystal heterostructures was demonstrated using square spiral 3D structures with embedded vertical column 2D structures. Heterostructures were fabricated with four, six, and eight vertical square spiral periods. At normal light incidence, the 2D-3D heterostructures exhibited reflection peaks and defect mode resonance peaks. However, the peak height values decreased with increasing number of vertical periods due to structural degradation.;To investigate the observed structural deterioration, a series of square spiral thin films with increasing number of vertical periods was deposited. The standard deviation of column-to-column spacing was found to steadily increase with increasing number of vertical periods. The square spiral sample with three vertical periods was observed to produce the largest reflection peak, at 70.9%.;The fabrication of three-dimensional (3D) photonic crystals based on the direct silicon [001]-diamond:1 architecture, which utilizes two-dimensional (2D) substrate topography, was investigated using the phi-sweep algorithm. The phi-sweep process was found to modify the tilt angle, beta, of slanted columns according to tan(betaPS) = tan(betaTG) · cos(gamma), where gamma is the phi-sweep offset angle. The phi-sweep process with gamma = 26.5° was also found to minimize interstitial deposition during the GLAD process, to improve the cross sectional uniformity of columns, and to improve the optical properties of silicon square spirals, producing a relative peak width of 16.1 +/- 0.1% in the normal incidence reflection spectrum.;Finally, the inverse silicon [001]-diamond:1 photonic crystal geometry was fabricated using a template inversion process. Silicon square spirals were oxidized to form silica templates. At T = 700°C, a filling fraction of fspiral = 0.68 +/- 0.01 and a column tilt angle of beta = 56 +/- 2° were observed, compared to the optimum values of fspiral = 0.81 and beta = 52°. |
