Obstacle Avoidance Trajectory Planning And Position Pre-correction Based On Wafer & Substrate Handle Robot

The integrated circuit(IC)industry is a symbol of modern science and technology.One of the important indicators for measuring a country's economic development,political and national defense strength is the technological level and industrial scale of the integrated circuit industry.The handle robot integrated equipment is one of the most important devices in the semiconductor processing process,and its core is the robot and the matching position precorrection system.The handle robot mainly completes the fast,accurate,stable and reliable transmission and positioning of the wafer and ceramic substrate between multiple processes.The position pre-correction system is used in conjunction with the transfer robot to correct the positional deviation of the material and improve the positioning accuracy of the transfer.The performance of the handle robot integrated equipment directly affects the reliability and automation level of the integrated processing technology,which is of great significance to the development of the IC industry.In this paper,the trajectory planning and obstacle avoidance movement methods of the robot are deeply studied for the high precision,high efficiency,high stability and obstacle avoidance requirements of the wafer and substrate handle robot.The structure and correction algorithm of the position pre-correction system applied to the wafer and ceramic substrate were designed and tested.After studying the relevant literature at home and abroad,this paper analyzes the research status of the trajectory planning and position pre-correction system of the handle robot.In the first chapter,the overall research plan of the thesis is determined,the R-?-type handle robot was selected as the research object,the trajectory planning and obstacle avoidance research were carried out,and the research on the position pre-correction of the wafer and the ceramic substrate was determined.Then,this paper analyzes the motion of the transport robot,based on the threedimensional structure model of the robot,establishes the end arm telescopic model which can only do telescopic motion,and performs motion derivation.This paper also constructs the DH coordinate system of the robot,and derives the robot's Positive and negative kinematics equations and kinematic equations.In the trajectory planning,cubic polynomial interpolation and fifth-order polynomial interpolation are used in the joint space respectively.The trajectory planning of the robot is simulated by MATLAB software,and the advantages of the fifth-order polynomial interpolation in the performance of smooth motion and small impact force are obtained.Then,with the equipment casing as the obstacle object,the obstacle avoidance problem of the handle robot during the movement is analyzed,and the two obstacle avoidance methods of homing obstacle avoidance and simultaneous obstacle avoidance are proposed.Under the constraint condition,the four motion paths are simulated on MATLAB with the time-optimal as the goal.The results show that the simultaneous obstacle avoidance movement takes less time and can save about 20% of the time.According to the different research objects,the position pre-correction system for wafer and ceramic substrate is designed by means of the handling function of the existing robot in the laboratory.The former adopts a linear geometric algorithm to locate the centroid of the wafer,and locates the wafer notch by the sharp change characteristic of the end position.According to the data collected by the laser transmissive sensor,the motor is controlled to move and cooperate with the robot to realize the crystal Correction of the positional deviation of the circle and adjustment of the notch rotation angle.The latter designed a correction structure,supplemented by the handling of the robot,to correct the positional deviation of the ceramic substrate in the cartridge.Finally,the position of the markers on the two materials were observed by means of a camera with an external flip device.Experiments show that after correction,the former has a positioning accuracy of 16.31?m,and the latter has a positioning accuracy of 32.52?m,which respectively realizes the pre-corrected work energy.