Research On Power Integrity Co-analysis And Design Of High-speed Circuit Board And Package

With the rapid development of electronic technology,the integration of ICs is higher and higher,and the power supply voltage is lower and lower.Therefore,the fluctuation of power supply voltage and ground voltage may be fatal to high-speed electronic systems.Analysis and design of power integrity becomes one of the most important research topics.Solder balls connect packages and circuit boards and their arrangement has great effect on electronic systems.Full-wave methods are accurate but inefficient in power integrity analysis since the size of balls and the size of power/ground planes are different.In this paper,a resistance inductance capacitance conductance(RLCG)model combining the distributed and lumped equivalent circuits is used to make quick calculation of a ball grid array(BGA)package mounted on a printed circuit board(PCB).Compared with the full wave simulation,computation time is decreased sharply.In addition,some design rules are obtained by optimizing the power/ground balls arrangement for good power integrity performance in SIwave software.To suppress the bounce noise in power and ground planes,the coplanar electromagnetic band gap(EBG)structure formation mechanism is researched and then a hybrid EBG structure is proposed in this paper.Compared with the Meander-EBG structure and the L-EBG structure proposed in references,the proposed hybrid EBG structure has lower cut-off frequency and wilder noise suppression bandwidth.Both the simulation and measured results show that the stopband of the proposed structure can span from 270 MHz to 20 GHz with-30 dB noise suppression standard.