Research On The Design And Integrated Printing Of LTCC Inductor

With the development of electronic products towards miniaturization,functionalization and high integration,LTCC(Low Temperature Co-Fired Ceramic)technology has become the mainstream of electronic components integration.The traditional LTCC technique is complex with many manufacturing processes and low yield.3D printing,an advanced manufacturing technology based on the principle of discrete accumulation,which can achieve the rapid,flexible and integrated manufacturing of the device.It provides a new method for the manufacture of LTCC devices.In this paper,a LTCC inductor was designed and integrated printed by means of theoretical analysis and experimental research.A LTCC polyline inductor was designed and optimized by the three-dimensional electromagnetic simulation software HFSS.The 3D electronic printing process based on multi-materials printing technology was studied,and the co-firing process of the printed LTCC inductor was studied,too.The performance of the printed inductor was tested.The shrinkage phenomenons in the co-firing process of nano-silver and LTCC substrate were analyzed,and the influences of sintering temperature and heating rate on the performance of the device were discussed.The simulation results of the LTCC polyline inductor show that the inductance L value is 5.12nH,the Q value is 101.86(1GHz),and the resonant frequency is 2.50GHz.Multi-materials printing technology can better achieve the integration of nano-silver wire and ceramic substrate.The high density(2.5±0.16)g/cm~3 is achieved when sintered at 850?.The average dielectric constant is 5.4 under the frequency of 2.4 GHz.The test results show that the inductance L=5.76nH,Q=32.99(3GHz),The results indicate that the printed LTCC substrates basically meet the requirements for LTCC applications.The paper studies the feasibility of the 3D printing technology in the production of LTCC inductor,which may provide a new way for the inductor manufacturing and lay a good foundation for further research.