Design And Realization Of Assembly Of 10Gb/s EML To TOSA

With the rapid development of optical communication,more and more information is needed in the field of communication.The main network of optical communication mainly uses optical devices with long distance transmission.Because of the chirp effect of the village,the ordinary direct modulation laser can not meet the requirement of high speed long distance transmission.So,in the long distance transmission system,the external modulation laser is generally used.Due to the complex design structure of the external modulation laser,the optical device packaging technology for the chip requires higher requirements.In the last two years,the coaxial encapsulated electric absorption modulation laser(EML)is again hot in the market of optical devices.The coaxial package is mostly flat packaging because of its small size,low cost and convenient connection.In the package dimension,coaxial package is mostly flat package.Therefore,coaxial package laser is widely used in optical transceiver module of optical network.However,the earlier EML lasers for the 10Gb/s high-speed module XFP and SFP+ coaxial package have not been widely used.The main reason is that the high frequency characteristics of the 10Gb/s coaxial laser and the thermal design of the laser are mainly due to the failure to meet the practical requirements of the EML laser module.In this paper,the design and encapsulation of the electronic absorption modulating laser components with a transmission rate of 10Gb/s,a transmission distance of 40 km and a coaxial package are carried out.The main work is as follows:(1)according to the requirements of the high speed laser,the overall design scheme of the EML module is given,including the selection of TEC and the thermistor,the calculation of thermal simulation,the simulation calculation of the high frequency circuit,the evaluation and calculation of the reliability results.(2)the high frequency circuit,the FPC flexible circuit board and the external structure of the device were designed.(3)the test system is built to test and optimize the performance of the EML components designed.The results show that the external structure of the laser components,the light power,the eye picture margin,the extinction ratio,the temperature coefficient,the wavelength stability,the channel cost and so on,all achieve the practical requirements,and the reliability of the components is high and full.Foot Telcordia international standard can be used for 10Gb/s XFP and SFP+ optical modules.