Design Of Wear Detection System For Grinding Wheel Blade And Research On Error Compensation For Dicing Saw

In recent years,with the development of electronic chips,automotive electronics,artificial intelligence,Internet of Things and other industries,demand for semiconductor equipment has increased sharply.The dicing saw is one of the most equipment in semiconductor packaging process.At present,most of the high-level dicing saw on the domestic market need to be purchased from abroad.The high price and long supply cycle seriously restrict the development of semiconductor industry in China.In order to meet the urgent needs of domestic semiconductor manufacturers for dicing saw equipment,in this paper,the key technologies such as the wear detection system of grinding wheel blade and the error compensation of each axis for fully automatic 12-inch dual-axis dicing saw were studied respectively.The main contents include the following aspects:(1)This paper introduces the general composition and working principle of the dicing saw.The principle of contact and non-contact grinding wheel blade wear detection were analyzed in detail,and the expected technical targets were setted.A contact grinding wheel blade wear detection scheme based on digital signal and analog signal,and a radial and axial non-contact grinding wheel blade wear detection scheme were proposed.(2)Hardware design and software programming of the grinding wheel blade wear detection system were carried out.Hardware design including the selection of motion control card and optical fiber sensor,and the design of hardware circuit diagram;Software programming including the design of the grinding wheel blade wear detection flow chart,the design of PLC,the design of host computer interface,the design of reliability setting,and the design of PC software.(3)The wear detection system of grinding wheel blade was tested The results show that the contact grinding wheel blade wear detection scheme based on digital signal and the radial non-contact grinding wheel blade wear detection scheme are more effectively.The maximum measurement error is less than 5?m,the maximum error of dicing depth is 6?m,and it has the advantages of short response time,stability and reliability(4)In order to reduce each axis of the linear displacement error,the factors that lead to the linear displacement error of the dicing saw were analyzed.Based on the analysis of the measurement principle of laser interferometer and PMAC compensation principle,the positioning accuracy and repetitive positioning accuracy of the dicing saw were improved by three ways:pitch compensation,gap compensation and template compensation.(5)The experiments of optical glass dicing process was carried out,the influence of fastening method,the types of dicing blade and the dicing water flow on dicing K9optical glass were studied.The experiment result shows:when the glass plate was used to fix the upper plate method,the resin was used blade,and the dicing water flow was4.5 L/min,the best surface quality of the workpiece was achieved,which the width of chipping can be controlled within 5.8?m,and the surface roughness can reach R_a10.5nm.