| In order to meet the needs of large-capacity and high-speed data transmission inside the spacecraft and improve the data transmission performance inside the spacecraft,it is necessary to explore the application of high-speed interconnection technology in the spacecraft.In the spacecraft,the bus plays a key role.The bus serves as a data communication bridge between the electronic devices inside the spacecraft,between the boards inside the electronic equipment,and between the chips on the board.Data and control signals are transferred by bus between electronic devices to maintain the normal operation of the spacecraft.This paper focuses on solving the problems of low transmission rate,poor reliability,poor error correction and tolerance,and insufficient flexibility of the existing aerospace bus,which cannot meet the large capacity and high-speed data transmission requirements of the spacecraft.The application of RapidIO should be studied in aerospace electronic systems so that the above problems can be solved.RapidIO is a mature high-speed interconnect technology in the embedded field.It has passed many iterations and has an excellent ecosystem.The shortcomings of the existing aerospace bus can be solved effectively and the internal data transmission demand of the spacecraft can be met by the features of RapidIO,such as standardization,modularization,universalization.In this paper,the serial physical layer protocol of RapidIO is studied based on the full investigation of RapidIO high-speed interconnect technology.First,the development history of RapidIO and the current state of research of RapidIO is surveyed.The differences of Space Fibre,PCIe,Ethernet and RapidIO are also compared and then RapidIO technology is decided to apply in aerospace electronic system.Second,the characteristics of the RapidIO standard are studied,and the details of the RapidIO technology are mastered.The significant advantage of RapidIO is that the packet overhead is small,and it is suitable for data transmission in the embedded field,including the aerospace field.Third,the implementation process of RapidIO serial physical layer is introduced in detail,including serial protocol sublayer(SPS),physical coding sublayer(PCS)and physical media attachment sublayer(PMA).Finally,the design of RapidIO serial physical layer is tested.Xilinx FPGA development software tool Vivado is used to simulate each submodule of the serial protocol sublayer and the physical coding sublayer,and then the whole design is simulated.After all the simulations are completed,the design of RapidIO serial physical layer is tested on development board.The built-in logic analyzer of Xilinx FPGA is also used to capture and analyze internal signal of RapidIO serial physical layer.In this paper,internal high-speed transceiver of Xilinx FPGA is used as the physical medium attachment sublayer in the RapidIO serial physical layer.On this basis,the serial protocol sublayer and physical coding sublayer in the RapidIO serial physical layer are implement in Xilinx FPGA.The advantages of realizing RapidIO serial physical layer in above manner are that the dependence on IP cores of companies such as Xilinx is abandoned and independent controllability of RapidIO serial physical layer is achieved.RapidIO has the advantages of modularity,reliability,and low overhead.Through the application of RapidIO technology in the aerospace electronic system,the data processing and data transmission performance of the aerospace electronic system is improved.The final test results show that the RapidIO serial physical layer works in 1x mode and the transmission rate is 2.5Gbps,which meets the protocol requirements of the RapidIO high-speed interconnect standard.Through research on RapidIO high-speed interconnection technology,the RapidIO serial physical layer is designed and verified,including serial protocol layer,physical coding sublayer and physical media attachment sublayer.The experimental results show that the RapidIO serial physical layer can provide support for data transmission between electronic devices inside the spacecraft,and can provide some reference for the further exploration of the application of high-speed interconnection standards in aerospace electronic systems. |