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The Study On The Technology And Mechanism Of Ultrasonic Fixation Of Banded Metal Foil

Posted on:2019-06-22Degree:MasterType:Thesis
Country:ChinaCandidate:Z Y XiaoFull Text:PDF
GTID:2382330596950447Subject:Engineering
Abstract/Summary:PDF Full Text Request
Ultrasonic solid bonding manufacture technology is a solid phase connection method of metal foils under high pressure in term of piezoelectric characteristics of piezoelectric transducer to produce high frequency vibration on metal surface,whose problem is poor mechanical properties and unclear mechanism of solid joints,which can not meet the requirements of high strength and hardness,and also are not conducive to further research.Targeted to improve the mechanical properties of ultrasonic solid joint and analyze its forming mechanism,through experiments of peeling experiment,surface hardness test,thermocouple temperature measurement and so on,combined with finite element simulation and numerical simulation,etc.to obtain the optimum process parameters and to explain its forming mechanism from aspects of heat,microstructure and so on.The specific work is as follows:(1)Combined with previous studies,ultrasonic solid bonding process parameters,such as bonding pressure,vibration amplitude,etc.were selected to measure the peeling strength and surface hardness of dissimilar metal joints by single factor variable and orthogonal test.The changes of mechanical properties of solid joints with different ultrasonic bonding parameters,and the appropriate process parameters to enhance the peel strength and surface hardness were obtained.(2)According to the principle of material forming,the temperature distribution of ultrasonic solid joint interface is simulated with finite element method,and the variation law of interface temperature with process parameters is obtained by thermocouple experiment.Based on Hertz contact theory and Coulomb friction law,the stress distribution of ultrasonic bonding interface is calculated,its forming principle is analyzed and plastic formation of ultrasonic solid bonding manufacture technology is concluded.(3)The causes of metal plastic deformation at the solid joint interface are theoretically analyzed.The microstructure of the joint is observed by scanning electron microscope,and the interface composition is analyzed by energy spectrometer.The results show that the bonding action of metal atom key,the viscoplastic deformation heat of metal itself and the diffusion reaction between metals play a decisive role in the formation of ultrasonic solid bonding joints.
Keywords/Search Tags:ultrasonic bonding, process parameters, finite element simulation, bonding mechanism, temperature field distribution, microstructure
PDF Full Text Request
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