| Chip enhanced cooling is a key scientific and technological problem facing the country’s major strategic needs.Thermoelectric cooler is one of the effective ways to cool chips.It is necessary to establish a unified thermoelectric cooler model and analyze the working characteristics under the cooling mode.However,the existing ideal model is based on an ideal single stage device structure,ignoring the contact resistance and contact thermal resistance,and it cannot give a better description of the characteristics of the devices.This thesis makes a systematic theoretical analysis and numerical simulation of heat transfer characteristics and mechanism in the thermoelectric cooler by using the thermal resistance network method,and establishes a contact effect model of the thermoelectric cooler,which can be used as the development of the high performance thermoelectric cooler.The results show that the arm of the thermoelectric cooler should be shorter when making a thermoelectric cooler with greater capacity,and be longer when making a thermoelectric cooler with greater cooling flux,so the appropriate length of the thermoelectric arm should be selected according to the actual demand.When the cold end temperature is not fixed,and the temperature difference of the cold and hot end decreases,the cooling capacity per unit area of the thermoelectric cooler will increase continuously.When the cold end temperature is fixed,the cooling capacity per unit area will increase with the size of the thermoelectric arm shorter.Secondly,the process of thin film thermoelectric cooler’s cooling chip is numerically simulated.The refrigeration performance of thin film thermoelectric cooler was analyzed with the change of current.The influence of contact resistance and contact thermal resistance on the cooling temperature of thin film thermoelectric cooler was analyzed.The results show that the impact of thermal contact resistance is more significant than electrical contact resistance on the performance of TE coolers.It was found that the existence of interface contact effect reduces the maximum average cooling effect of the thermoelectric cooler on chip hot spots,which is reduced by 5.6K.And the contact thermal resistance has a greater impact on the cooling performance than contact resistance when it’s in the effective working current range. |
