| Press-Pack IGBT module is a new type of high-power electronic device.Press-Pack IGBT module adopts pressure contact packaging to form electrical connection and thermal conduction,they have advantages like compact structure,double-side heat dissipation,high power density,easy to connect in series,etc.Therefore,they are widely used in VSC-HVDC and traction systems.At the same time,press-pack IGBT module has short ciucuit failure mode(SCFM)characteristic,which is when a press-pack IGBT module fails,it will show a short-circuit status.This characteristic plays an important role in occasions which adopt lots of series circuits and can improve the reliability of power electronic equipments.Yet,few scholars studied on this characteristic so far.SCFM whether achieved is related to the reliability and age of power electronic equipments,therefore SCFM is an important link of IGBT designing.In this thesis,SCFM characteristic of press-pack IGBT module is studied by experiments and simulations.Firstly,press-pack IGBT module packaging and its advantages and disadvantages is introduced.And the structure of a kind of packaging form is introduced in detail.Secondly,based on the real conditions of IGBT module,a set of experimental program is proposed and a experiment platform is build.Thirdly,comparison and analysis is made after overcurrent-experiments and current-aging-experiments.Characteristics of four kind of submodules are obtained.It proves that utilizing aluminum or silver can ramarkably improve the SCFM performance of press-pack IGBT module.Finally,transient thermal simulations are made to calculate the temperature change,melt and vaporization zone of various materials in submodules under two kinds of heat source conditions.Simulation result is coincide with experiment result,which proves simulation is an effective method. |
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