Simulation On Integrated Passive Inductor For MEMS Packaging

Micro-electro-mechanical systems(MEMS)packages are moving into the direction of high-density and miniaturization.MEMS package interposers provide environmental protection,electrical interconnection,thermal management and other functions for device,is a key component of MEMS package.It is an important way to increase the packaging density of the MEMS system by realizing the vertical interconnection of the package interposer through the conductive vias and embedding the passive components such as inductors into the package interposer.In the material of MEMS package interposer,compared to the silicon material,glass has a lot of advantages such as low coefficient of thermal expansion,good air tightness,strong insulation and low cost.However,the compatibility of semiconductor,the difficulty of processing and other issues hinder the development of glass interposer technology.Based on the pre-process and simulation of MEMS glass interposer,this paper further studies the key technology of MEMS glass interposer by simulating vertical through vias and embedded passive inductors.Firstly in order to compare the vertical interconnection characteristics of glass materials with conventional silicon material,the structural model of TSV is established by 3D full wave electromagnetic simulation software HFSS,which is used to analyze the influence of physical parameters including TSV diameter,space,height and insulator thickness on signal transmission performance.Design guidelines for the TSV are proposed.In order to improve the transmission performance,the diameter and the height of TSV should be small.Secondly the structural model of TGV is established by 3D full wave electromagnetic simulation software HFSS,which is used to analyze the influence of physical parameters including TGV diameter,space and height on signal transmission performance.Design guidelines for the TGV are proposed.In order to improve the transmission performance,the diameter and the space of TGV should be wide.Finally,the structural model of integrated passive inductor is established by 3D full wave electromagnetic simulation software HFSS,which is used to analyze the influence of physical parameters including inductor diameter,inductor thickness,glass thickness,inductor width and inductor space on quality factor and inductance.A method for manufacturing integrated passive inductor based on glass reflow process is introduced.Manufacture higher thickness inductor by glass reflow process compared to the conventional thin film process.This can provide guidance for the future design of integrated passive inductor.