Design And Development Of Digital EFO Fire Ball System For Wire Bolding Machine

As the core in the links of LED semiconductor packaging equipment,fully automaticgold wire ball bonding machine is mainly used for chip packaging before the internalwire welding,it is a blend of image recognition technology,the motion control technology,power electronics technology and IC binding technology of highprecision equipment,in the LED industry and even the entire semiconductor industry plays an important role.Digital EFO play fire system as a gold wire ball bonding machine "heart",its stability and burning process of lighter ball effect plays a decisive role,the system has high and low pressure double circuit output,core principle is to first light through the high pressure air breakdown between flint rod and wire forming pathway,recycling to burn the ball current low voltage to maintain this pathway,and the burning time and burning ball current decided to solder ball diameter and shape,solder ball is used to increase gold and the contact area on the surface of the cup and reinforcing diode pin solder joints,ensure the quality of LED diode welding qualified.This topic mainly aims at the welding line machine to hit the fire ball the present situation carries on the thorough research,to the current influence the spark ball stability and the precision reason carries on the discussion and the analysis.Some optimization and improvement are made on the basis of the existing hardware circuit of firing ball,and the virtual welding detection module is added to test the effect of firing ball in various voltage and time periods.Finally,a digital EFO firing ball system with higher reliability based on STM32 is designed.Light on the design of the control system mainly includes two parts,hardware and software of the hardware mainly includes the power supply module design,module design push-pull circuit design,high voltage driving circuit design,protection and lighter startup circuit design,current sampling module design,burning ball current control module design,the optical coupling isolation driver module design,DA output circuit module design,PWM circuit and PC communication module design;The design of software module includes serial communication module,DA parameter setting module and PID algorithm to control the current of ball firing.The design fully meets the welding line requirements of LED semiconductor devices through high-voltage ignition test,low-pressure ball firing effect test of the experimental prototype,as well as relevant data records of ball firing current,ball firing time and welding ball diameter.