Study On The Preparation And Properties Of Wave-transparent Materials For 3D Printing

Wave-transparent resin matrix radome composite is an excellent functional materials which combine the wave-transparent property and mechanical property.However,the traditional preparation process is cumbersome and difficult to process for complex components.With its unique forming principle,especially in the forming of complex periodic structure,3D printing technology can solve these problems effectively.Therefore,this paper is committed to study the wave-transparent material which suitable for 3D printing.(1)Fused Deposition Modeling(FDM)is used extensively due to its economy,simplicity and wide usage.Polylactic acid(PLA)was selected as the matrix on the basis of the performance requirements of FDM materials and wave-transparent materials.Through the process parameter optimization for PLA,it is concluded that the best printing parameters: 0.1 mm,40 mm/s,200 °C.Then,the different filling rate of the print samples were prepared and tested on the basis of the best print conditions.The results show that the relative density increases with the rising filling rate,but the growth rate is different for different shapes and structures.The strength and rigidity of the specimen were improved with the relative density,but opposite to the change of the dielectric properties.(2)With hollow glass microspheres(IM16K)filled the PLA,microstructure and properties of composite were characterized.The results show that IM16 K improved the dielectric properties,fluidity and heat resistance of IM16K/PLA.However,the strength and toughness of IM16K/PLA were weaker than before.The mass fraction 9% of IM16 K /PLA composites can meet the needs of 3D printing and wave-transparent materials.(3)SEBS-MAH were selected as compatibilizers,high impact polystyrene(HIPS)/PLA alloy were prepared by melt blending.Structure and properties of alloy were characterized.The results show that HIPS can effectively improve the dielectric properties and toughness of HIPS/PLA,but the strength,rigidity significantly decreased because of the strength,rigidity of HIPS and the poor compatibility.