Study On Preparation And Performance Of High Thermal Conductivity Silicone Rubber

With the rapid development of the electronics industry,electronic devices and electronic components are required to be multifunctional and show a high performance,and they tend to become smaller,lighter and thinner.The increase in heat production of electronic equipment and the increasing density of electronic devices make heat dissipation more difficult,resulting in a significant reduction in the life of electronic components.For electronic components to work properly and to increase their service life,high-thermal conductivity materials are required for packaging.Silicone rubber has attracted the attention of researchers for use in many thermally conductive materials due to its wide thermal conductivity range,good adhesion to materials,good insulation and weather resistance.Graphene oxide(GO)treated with dicyclohexylmethane-4,4'-diisocyanate(HMDI)was first synthesized and termed FGO.Fourier-transform infrared spectroscopy(FTIR),scanning electron microscopy(SEM),and X-ray diffractometry(XRD)were carried out to characterize the FGO structure.The results showed that the dispersibility of FGO in solvent was improved.Room-temperature vulcanized silicone rubber was prepared with hydroxy-terminated polydimethylsiloxane(HPDMS)treated with FGO as a co-crosslinking agent,resulting in FGO/HPDMS.The FGO/HPDMS nanocomposites were proven to be successfully prepared by FTIR and XRD.The effects of different addition amounts of FGO on the crosslink density,thermal conductivity,volume resistivity,fixed time,viscosity hot air before and after aging,Shore hardness,and high temperature weight loss rate of the FGO/HPDMS nanocomposites were investigated.As the amount of FGO was increased,the thermal conductivity and mechanical properties of the FGO/HPDMS nanocomposite increased.At 20%addition of FGO,the corresponding thermal conductivity of the FGO/HPDMS nanocomposites was 1.24 W/m K.