| With the rapid development of modern general semiconductor technology,the chip power of information equipment in the field of modern electronic countermeasures continues to increase,and the heat flux density of electronic devices has also increased dramatically.This has brought great challenges to the packaging of equipment chips and components.Not only does the packaging material need to have good thermal compatibility and higher strength with the chip,but also requires the packaging module to have excellent heat dissipation performance.Therefore,this paper proposes an electronic packaging module with a built-in flow channel structure.The packaging module is made of graded aluminum-silicon alloy,which has the advantages of low expansion and high thermal conductivity.The packaged module will pass cooling liquid during operation to achieve the purpose of forced heat dissipation.Therefore,the pressure resistance and sealing of the flow channel must be considered in production.As a precision connection process,diffusion connection has excellent joint quality and is suitable for the connection between the module case and the cover plate.Therefore,this paper will provide a theoretical basis for the development of a gradient aluminum-silicon alloy electronic packaging module with a built-in runner structure by studying the diffusion connectivity of Al-27%Si alloy and pure Al,Al3003,Al6063 alloy.In the early stage,Al-27%Si,Al4047 and Al5A06 were used as cover materials to conduct diffusion welding test with Al-27%Si alloy,but the welding effect was not ideal,and the three groups of joints were not welded.Then,by drawing on the existing mature technology of aluminum alloy diffusion welding,a self-designed vacuum diffusion bonding device was used to conduct the solid phase diffusion connection experiment of Al-27%Si alloy and pure Al,Al3003,Al6063 alloy.In the experiment,OM was used to analyze the microstructure of the above three sets of diffusion couples,and the formation mechanism of the joint was analyzed.The universal joint testing machine was used to test the tensile strength of the joint to evaluate the mechanical properties of the joint.Later,6063 aluminum alloy was used as the cover plate material and the gradient 50 Si 27%Si layer was used for diffusion welding experiments,in order to illustrate the feasibility of packaging modules in process production.The test results show that when the welding temperature is 520-540?,the welding pressure is 0.6-1.2MPa,and the holding time is 8-12 h,the Al-27%Si alloy can successfully achieve diffusion link with pure Al,Al3003,Al6063,and the welded joint is tightly combined.There are no microscopic voids at the interface.In the experiment,a gradient aluminum-silicon alloy electronic packaging module with a liquid-through structure was designed,and 6063 aluminum alloy was used as the cover plate to perform a diffusion connection verification experiment with the Al-27%Si layer of the gradient 50 Si alloy.The physical packaging module deformed slightly and the joint was joined Dense,showing excellent diffusion connection performance.It can be proved that the aluminum-silicon alloy can realize the welding connection between the materials through the diffusion connection method,and the gradient structure can be used to realize a liquidthrough structure electronic packaging module.The experimentally measured Al-27%Si/Al joint tensile strength is 130.6MPa,Al-27%Si/Al3003 joint tensile strength is 124.2MPa,Al-27%Si/Al6063 joint tensile strength is 132.9MPa,The strength is equivalent to the strength of the 50%Si layer in the gradient 50 Si alloy,meeting the overall strength requirements of the flow channel gradient tube shell. |
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